烤箱的联机系统

EAP设备自动化（Equipment Automation Programming）
EAP（Equipment Automation Programming）实现了对生产线上机台的实时监控，是工厂自动化不可缺少的控制系统。EAP系统与FAB中的机台紧密相关，系统的设计与开发必须与生产线的机台实际生产流程相一致，才能达到控制机台生产的目的。
EAP是MES与设备的桥梁，EAP通过SECS国际标准协议与机台进行数据传输。SECS是半导体设备（半导体行业称设备为机台）必须遵循的一种国际通信协议。EAP就是通过SECS与设备通信、传输数据、发送指令控制设备按照预先定义的流程进行生产加工，达到对设备远程控制和状态监控，实现设备运行的自动化。
EAP是CIMS系统最低层的子系统，也是FAB中最为关键的系统之一。所有的生产过程，生产数据和机台状态数据都是通过EAP系统收集，然后传送给MES、AS等服务器对应的数据库，MES通过这些数据对产品和设备事件进行跟踪和监控。如果没有EAP系统FAB中的CIMS就没有实际的意义，生产的自动化也就无从谈起。EAP系统的开发基于SECS国际标准协议。
EAP在CIMS中的地位
EAP是CIMS系统与设备系统联系最紧密的子系统，也是CIMS中底层的系统。FAB生产线实现自动化过程中，EAP是不可缺少的子系统。

EAP系统功能
设备初始化控制。当设备需要重启并建立了通讯连接后，需要进行一些初始化工作，如定义事件、警报等。
物料状态跟踪。实时对正在设备上加工的物料状态进行跟踪监控，如晶圆目前正在哪个加工仓(Chamber)，进行哪一个步骤的加工等。
警报管理。当机台出现故障时，根据机台的警报及时传达给相应的设备工程师，以便及时处理。
机台状态监控。实时监控机台的状态，是运行、空闲还是维护等，以便合理地利用机台，提高设备利用率。

配方管理。机台在跑不同批次的货时，采用不同的配方，设备自动化系统通过对每一批货的判断，指示机台采用相应的配方进行加工。
数据采集。在半导体生产过程中，将会产生大量诸如温度、压力等参数，这些参数对于晶圆能够保持在正常合理的参数下进行加工，有着非常重要的参考价值。在生产运行过程中，当工艺设备生产到一定的批数以后，有些参数会漂移，通过缺陷检测分类系统能够及时探测到偏差，并通过 Run-to-Run 的实时方式做调整，不断搜集机台当前运行的参数，当参数偏离原值、并可能超出设定的区间范围时，可以通过实时调整的方式直接修改参数，并不断的反馈、调整以确保生产的正常运营。
机台生产模式控制。控制机台的生产模式，是自动生产还是手动操作。因为有些情况，机台需要手动操作，比如在上线测试的时候。

EAP 
EAP (equipment automation programming) realizes the real-time monitoring of machines on the production line. It is an indispensable control system for factory automation. EAP system is closely related to the machine in fab. The design and development of the system must be consistent with the actual production process of the machine in the production line in order to achieve the purpose of controlling the machine production.
EAP is the bridge between MES and equipment. EAP transmits data with the machine through secs international standard protocol. Secs is an international communication protocol that must be followed by semiconductor equipment (equipment is called machine in semiconductor industry). EAP is to communicate with the equipment, transmit data and send instructions through secs to control the equipment to carry out production and processing according to the pre-defined process, so as to achieve remote control and status monitoring of the equipment and realize the automation of equipment operation.
EAP is the lowest subsystem of CIMS system and one of the most critical systems in fab. All production process, production data and machine status data are collected through EAP system and then transmitted to the database corresponding to MES, as and other servers. MES tracks and monitors product and equipment events through these data. If there is no EAP system, CIMS in fab has no practical significance, and production automation is impossible. The development of EAP system is based on secs international standard protocol.
The position of EAP in CIMS
EAP is the most closely related subsystem between CIMS system and equipment system, and it is also the bottom system in CIMS. EAP is an indispensable subsystem in the automation process of Fab production line.
EAP system functions
Device initialization control. When the device needs to be restarted and a communication connection is established, some initialization work needs to be carried out, such as defining events, alarms, etc.
Material status tracking. Track and monitor the status of materials being processed on the equipment in real time, such as which chamber the wafer is currently in and which step is being processed.
Alert management. When the machine fails, it shall be timely transmitted to the corresponding equipment engineer according to the alarm of the machine for timely treatment.
Machine condition monitoring. Monitor the status of the machine in real time, whether it is running, idle or maintenance, so as to make rational use of the machine and improve the utilization rate of the equipment.
Recipe management. When running different batches of goods, the machine adopts different formulas. The equipment automation system instructs the machine to adopt the corresponding formula for processing through the judgment of each batch of goods.
Data collection. In the process of semiconductor production, a large number of parameters such as temperature and pressure will be produced. These parameters have very important reference value for the wafer to be processed under normal and reasonable parameters. In the process of production and operation, some parameters will drift when the process equipment is produced to a certain number of batches. The deviation can be detected in time through the defect detection and classification system, and adjusted through the run-to-run real-time mode to continuously collect the current operating parameters of the machine. When the parameters deviate from the original value and may exceed the set range, The parameters can be directly modified through real-time adjustment, and continuous feedback and adjustment can be made to ensure the normal operation of production.
Machine production mode control. Control the production mode of the machine, whether it is automatic production or manual operation. Because in some cases, the machine needs to be operated manually, such as during on-line test.