半自动晶圆减薄前贴膜机 ATW-08/12

贴膜原理：防静电滚轮贴膜；

Film principle: anti-static roller film;

贴膜动作：自动拉膜和贴膜；

Film action: automatic film and film;

晶圆台盘：特氟隆防静电涂层接触式台盘；

Crystal platform plate: Teflon anti-static coating contact platform plate;

防静电控制：防静电特氟龙涂层晶圆台盘/防静电膜滚轮/除静电离子发生器；

Antistatic control: antistatic Teflon coated wafer disc / antistatic film roller / de-static ion generator;

切割系统：独特的手动可调整环形切刀适用于不同的晶圆外形，刀头带加热机构无任何飞边并省去修边,独特的手动直切刀为最省膜的设计；

Cutting system: the unique manual adjustable ring cutter is suitable for different wafer shapes, the knife head belt heating mechanism has no flying edge, and no trimming edge. The unique manual direct cutting knife is the most film-saving design;

切割刀温度：最高达 150 摄氏度；

Cutting knife temperature: up to 150 degrees C;装卸方式： 晶圆手动放置与取出；

晶圆定位： 通用标线/定位销设计；

loading and unloading mode: manual placement and removal of the wafer;

控制单元： 基于 PLC 控制并带大尺寸触摸屏；

Control unit: based on PLC control and with large touch screen;

晶圆良率： ≥99.9%；

Crystal yield: ≥ 99.9%;

贴膜质量： 没有气泡：（不包括灰尘颗粒气泡）

Quality of film: No bubbles: (excluding dust particle bubbles)

每小时产能：≥50-65 片晶圆；

hourly capacity: ≥ 50-65 wafers;

更换产品时间：≤ 5 分钟；

Replacement of product time: ≤ 5 minutes;

机器指示：三色灯塔显示机台工作状态；

Machine indication: three-color lighthouse display console operating status;