自动裂片机

适用于8”&6” wafer & 8” Frame;

For the 8 "& 6" wafer & 8" Frame;

手动上下料;

Manual loading and unloading;

自动裂片机构，可程序化控制；

Automatic crack mechanism, can be controlled;

摄像头自动对正晶圆切割道，Theta角度马达调整；

The camera automatically cuts the positive wafer cut, Theta angle motor adjustment;

程序可设定单向或双向裂片动作；

The program can set a one-way or two-way crack action;

控制单元：基于PLC控制器，带大尺寸触摸屏；

Control unit: based on PLC controller, with large size touch screen;

晶圆良率： ≥99.9%；

Crystal yield: ≥ 99.9%;

UPH：>=6～8 PCS；

UPH:>=6~8 PCS;

更换产品时间：≤ 5 分钟;

Replacement of product time: ≤ 5 minutes;

裂片质量：无崩角;

Riack quality: no collapse angle;