

产品中心

分类 



产品中心

浏览量:

1000

EFEM组件

零售价

0.0

元

市场价

0.0

元

产品编号

所属分类

EFEM关键部件

数量

库存:



产品描述

参数

EFEM(Equipment Front End Module)指在高洁净环境下，将单片晶圆通过精密机械手传输至工艺、检测模块的晶圆前端传输系统。EFEM从属于半导体生产设备，其中晶圆装载系统（Loadport）、晶圆运输机器人（Robot）、晶圆对准器（Aligner）是最核心的三大部件。

AEW6000系列EFEM主要完成对其他半导体设备的晶圆自动化传输。根据不同应用需求可搭载SEMI标准的FOUP、FOSB、OpenCasette、Smif Pod等装载单元，亦可实现不同装载单元的兼容配置。设备结构经过特殊设计并配备了微环境保持系统，可实现Class1的洁净度要求。系统可选配双面晶圆读码系统和晶圆翻转功能，能够稳定高效的完成各类晶圆的传输。

• 完全自主知识产权 • 标准化应用软件 • SECS/GEM通讯 • 可处理薄晶圆

• 多种上料方式兼容 • 安全高效传输 • 深度客制化订制

The AEW6000 Series EFEM is equipped primarily designed for automated wafer transfer to other semiconductor equipment. Depending on application requirements, it can be configured with SEMI-standard load ports such as FOUP, FOSB, Open Cassette, and SMIF Pod, and also supports compatibility configurations of different load ports. The equipment structure is specially designed and equipped with a micro-environment maintenance system, achieving Class 1 cleanliness standards. The system can be optionally equipped with a dual-side wafer ID reading system and wafer flipping function, ensuring stable and efficient performance in various wafer transfer scenarios.

• Fully proprietary intellectual property • Safe and efficient transfer • Deeply customized customization

• Compatible with multiple loading methods • SECS/GEM communication • Capable of processing thin wafers

扫二维码用手机看